European Union13 days leftNon-profit, Private Business, Research Institution, Public Institution, Other
Chiplet for Defence Application
EDF Research Actions
Funding Amount
Up to €25.0M
Deadline
16/10/2025
Eligible Organization Types
Non-profit, Private Business, Research Institution, Public Institution, Other
Trusted by
What is the Chiplet for Defence Application Call?
Grant Description
This call supports research actions to develop and share a common library of defence-grade chiplet building blocks and evaluate their application in military systems. It addresses high costs and supply chain risks of monolithic integrated circuits by promoting scalable, cost-efficient, EU-based chiplet architectures with heterogeneous integration. Projects must analyse state of the art, assess benefits and risks, define technical specifications, perform partial risk-reduction tests, and design a...
Required Results for Successful Funding
Expected Outcomes
• A common, shareable hardware library of EU-based chiplet building blocks tailored for defence applications
• Identification of EU chiplet technologies compatible with advanced defence architectures
• Demonstrated increase in competitive advantage of the European Defence Technological and Industrial Base (EDTIB) for component development and integration
• Validated heterogeneous SiP architectures offering multifunctional, scalable systems adaptable to capability needs
• Prototype demonstrator(s) showing optimized performance, power consumption, cost efficiency (including NRE), and supply-chain resilience for at least one military use case (e.g. radar, EW, communications, munitions, signal processing)
• Standardized chiplet interfaces, cybersecurity integration, and proof of compliance with harsh operational environments
• Roadmap for scalability (performance/features) and supply-chain deployment supporting future defence systems
• Foundations for AI-enabled functions within chiplet-based defence electronics
• Identification of EU chiplet technologies compatible with advanced defence architectures
• Demonstrated increase in competitive advantage of the European Defence Technological and Industrial Base (EDTIB) for component development and integration
• Validated heterogeneous SiP architectures offering multifunctional, scalable systems adaptable to capability needs
• Prototype demonstrator(s) showing optimized performance, power consumption, cost efficiency (including NRE), and supply-chain resilience for at least one military use case (e.g. radar, EW, communications, munitions, signal processing)
• Standardized chiplet interfaces, cybersecurity integration, and proof of compliance with harsh operational environments
• Roadmap for scalability (performance/features) and supply-chain deployment supporting future defence systems
• Foundations for AI-enabled functions within chiplet-based defence electronics
Funded areas
Scope Requirements
• Develop and share a common hardware library of chiplet building blocks and their defence applications
• Conduct a thorough analysis of possible heterogeneous SiP architectures and design at least one military application
• Use EU-based technologies wherever available, leveraging existing EU manufacturing facilities and civil Chips JU programs
• Ensure solution independence for defence systems (no external dependencies)
• Demonstrate cost efficiency for low-volume production, including non-recurring engineering (NRE)
• Optimize power consumption for targeted applications
• Analyze and demonstrate scalability: ability to adjust system performance and/or functionality via addition or removal of chiplets
• Optionally address integration of cybersecurity features to protect the resulting SiP
• Conduct a thorough analysis of possible heterogeneous SiP architectures and design at least one military application
• Use EU-based technologies wherever available, leveraging existing EU manufacturing facilities and civil Chips JU programs
• Ensure solution independence for defence systems (no external dependencies)
• Demonstrate cost efficiency for low-volume production, including non-recurring engineering (NRE)
• Optimize power consumption for targeted applications
• Analyze and demonstrate scalability: ability to adjust system performance and/or functionality via addition or removal of chiplets
• Optionally address integration of cybersecurity features to protect the resulting SiP
Additional Conditions for Applicants
Special Conditions
• Only activities a (knowledge generation), b (knowledge integration), c (studies), and d (design) of Article 10(3) EDF Regulation are eligible; activities e–i are excluded
• Compliance with REACH and ROHS regulations
• Standardized chiplet interfaces compatible with diverse military applications
• 2.5D/3D integration and advanced packaging (SiP) must rely on EU capacities
• Designs must be compatible with harsh environment operations of the targeted application
• Proposals must substantiate synergies and complementarity with specified Chips JU and European Chips Act initiatives (EDF-2022-RA-MATCOMP-PACOMP, DIGITAL-JU-Chips-2023-SG-CPL-2/3, IPCEI microelectronics)
• Admissibility and eligibility conditions (page limits, layout, eligible countries, financial/operational capacity) as detailed in Sections 5–7 of the call document
• Evaluation and award criteria, scoring, thresholds and timeline per Sections 8–9 of the call document and Online Manual
• Use of specified application templates, annexes and Model Grant Agreements
• Single-stage submission by 16 October 2025, 17:00 Brussels time
• Compliance with REACH and ROHS regulations
• Standardized chiplet interfaces compatible with diverse military applications
• 2.5D/3D integration and advanced packaging (SiP) must rely on EU capacities
• Designs must be compatible with harsh environment operations of the targeted application
• Proposals must substantiate synergies and complementarity with specified Chips JU and European Chips Act initiatives (EDF-2022-RA-MATCOMP-PACOMP, DIGITAL-JU-Chips-2023-SG-CPL-2/3, IPCEI microelectronics)
• Admissibility and eligibility conditions (page limits, layout, eligible countries, financial/operational capacity) as detailed in Sections 5–7 of the call document
• Evaluation and award criteria, scoring, thresholds and timeline per Sections 8–9 of the call document and Online Manual
• Use of specified application templates, annexes and Model Grant Agreements
• Single-stage submission by 16 October 2025, 17:00 Brussels time
Important dates
Deadline:16/10/2025
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