European UnionDeadline PassedNon-profit, Private Business, Research Institution, Public Institution, Other

HORIZON-JU-CHIPS-2025-CSA-JPN

HORIZON-JU-CHIPS-2025-CSA-JPN

Funding Amount

€500K - €1.0M

Deadline

17/09/2025

Eligible Organization Types

Non-profit, Private Business, Research Institution, Public Institution, Other

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What is the HORIZON-JU-CHIPS-2025-CSA-JPN Call?

Grant Description
This coordination and support action addresses the need for coherent EU-Japan cooperation in semiconductor research by coordinating life cycle assessment activities, facilitating researcher exchanges and stakeholder networking, and supporting joint R&I and industry workshops to strengthen chip supply stability.
Required Results for Successful Funding

Expected Outcomes

• Coordinate ongoing Japanese and EU R&I activities on LCA of semiconductor manufacturing processes and facilitate researcher exchanges to improve coherence.
• Support joint R&I activities between the EU and Japan and prepare potential future joint EU–Japan R&I collaboration topics in the semiconductor field.
• Explore and pilot financing mechanisms for talent exchanges between R&D or production sites in both regions.
• Foster increased cooperation with Japanese research institutions on the development, deployment and commercialization of digital technologies through targeted R&I collaboration.
• Support joint activities of companies across the semiconductor value chain to strengthen chip supply chain security.
Funded areas

Scope Requirements

• Organize and support networks, conferences, workshops and other actions to: – support semiconductor joint EU–Japan R&I activities and generate R&I priorities for potential future collaboration; – connect EU and Japanese companies in the semiconductor value chain to exchange information and propose measures to improve chip supply chain stability.
• Support exchange of researchers and closer coordination of running R&I activities in both regions addressing similar objectives, e.g. development of a reference database for LCA or greenhouse gas emissions in semiconductor manufacturing.
• Increase networking and collaboration among EU and Japanese stakeholders to address current needs, anticipate future requirements and stimulate long-term cooperation.
• Ensure engagement of relevant stakeholders from both the EU and Japan through regional and international workshops and a comprehensive set of communication and dissemination actions.
Additional Conditions for Applicants

Special Conditions

• Admissibility conditions: proposal page limits and layout as described in Appendix 5 of the Multi-Annual Work Programme of Chips JU (see Part B of the Application Form in the Submission System).
• Eligibility: types of eligible countries and other eligibility conditions as defined in Appendix 5 of the Work Programme.
• Financial and operational capacity and exclusion criteria: per Annex C of the Work Programme General Annexes.
• Evaluation and award: award criteria, scoring, thresholds, submission and evaluation processes, and indicative timeline as specified in Appendix 5 of the Work Programme.
• Legal and financial set-up of grants: rules in Appendix 5 and Annex G of the Work Programme General Annexes.
• Call documents: submission via the Funding & Tenders Portal, Application Form templates, Model Grant Agreement, Horizon Europe Programme Guide, and Appendix 5 of the Multi-Annual Work Programme of Chips JU.
• Submission model: single-stage call, opening 08 July 2025, deadline 17 September 2025 (17:00 Brussels time).
• Budget: total indicative budget EUR 1 000 000; individual grants between EUR 500 000 and EUR 1 000 000.
• Action types: HORIZON-JU-CSA (Coordination and Support Actions) and HORIZON Action Grant Budget-Based [HORIZON-AG].
Important dates

Open from: 08/07/2025

Deadline:17/09/2025

Application period has ended

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